Professional Experience

  • Assistant Professor (HIT Laboratory, Department of Software Convergence), Kyung Hee University. 2022.9 - Present
  • Research Professor (Department of Computer Science and Engineering), Pohang University of Science and Technology. 2022.3 - 2022.7

Education

  • Postdoctoral Researcher (Computer Science and Engineering, Advisor: Seungmoon Choi), Pohang University of Science and Technology. 2020.3 - 2022.2
  • Ph.D. (Creative IT Engineering, Advisor: Seungmoon Choi), Pohang University of Science and Technology. 2012.3 - 2020.2
  • Exchange Student (Infomatiks), Technische Universität Berlin. 2011.4 - 2011.9
  • B.S. (Electrical Engineering, Summa Cum Laude), Pohang University of Science and Technology. 2008.3 - 2012.2

Research Grants

  • Early-Career Researcher Innovation Laboratory (PI: Seungjae Oh), National Research Foundation of Korea (NRF). 2023
    The Haptic Methodology and System using Haptic Metamaterial
  • Early-Career Researcher Research Program (PI: Seungjae Oh), National Research Foundation of Korea (NRF). 2023
    The Haptic Methodology and System using Haptic Metamaterial
  • Postdoctoral Fellowship (PI: Seungjae Oh), National Research Foundation of Korea (NRF). 2020
    Mutual Identification between User-Device toward Seamless Cross-Device Computing
  • MSRA Collaborative Research (PI: Seungmoon Choi), Microsoft Research Lab Asia. 2019
    Vibration-Mediated Recognition of Hand Contact State for Tangible/Surface Interaction

Professional Service

  • Reviewer (2019): Computers & Education. ACM CHI LBW. ACM SIGGRAPH Asia Emerging Technologies.
  • Reviewer (2020): ACM UIST (2 Special Recognitions of Outstanding Reviews). ACM CHI LBW. IEEE RA-L(IROS). Eurohaptics.
  • Reviewer (2021): ACM UIST (1 Special Recognitions of Outstanding Reviews). ACM CHI. ACM CHI LBW. ACM IMWUT. IEEE World Haptics. IEEE RA-L.
  • Reviewer (2022): ACM IMWUT. IEEE RA-L.
  • Reviewer (2023): ACM CHI (1 Special Recognitions of Outstanding Reviews). IEEE RA-L. IEEE VR. IEEE World Haptics.
  • Reviewer (2024): ACM CHI (2 Special Recognitions of Outstanding Reviews). ACM UIST. IEEE TVCG. IEEE VR. IEEE RA-L. Eurohaptics.
  • Reviewer (2025): ACM CHI (2 Special Recognitions of Outstanding Reviews). IEEE TVCG. IEEE World Haptics.
  • Oranizing Commitee (2025): IEEE World Haptics.

Publications

Peer-reviewed Conference Paper
Peer-reviewed Journal Article
Peer-reviewed Poster and Demonstration

Patents

Domestic
  • Chaeyong Park, Seungjae Oh, and Seungmoon Choi.
    APPARATUS AND METHOD FOR RENDERING TACTILE TO PROVIDE MULTIPLE SENSE
    Application: 2019.12.6
  • Seungjae Oh and Seungmoon Choi.
    OBJECT IDENTIFICATION APPARATUS AND METHOD, SYSTEM COMPRISING THE SAME
    Application: 2019.11.29, Publication: 2021.6.29
  • Heejin Kim, Seungjae Oh, Sung H. Han, and Min K. Chung.
    3D INTERACTION METHOD FOR DISPLAY
    Application: 2016.9.30; Publication: 2018.4.4

Scholarships, Honors & Awards

  • Best Poster/Demo Award. Asian CHI Symposium (CHI 2019 Workshop), SIGCHI Japan Chapter. 2019
    VibEye: Vibration-Mediated Object Recognition for Tangible Interactive Applications
  • Outstanding Presentation Award. 2019 Spring Academic Workshop, SIGCHI Korea Local Chapter. 2019
    VibEye: Vibration-Mediated Object Recognition for Tangible Interactive Applications
  • Ranked top 250 out of 1000 selected applicants. Intel RealSense Application Challenge: IDEA Phase, Intel. 2014
    DisCo: A multi-agent collaborative discussion tool based on multimodal interaction
  • Best Poster Award. ACM Symposium on Spatial User Interaction. 2013
  • Graduate Scholarship. Kwanjeong Educational Foundation. 2012.3 - 2014.2
  • Undergraduate Student Scholarship Program. Korea Foundation for Advanced Studies. 2010.3 - 2012.2
  • National Scholarship for Science and Engineering. Ministry of Education, South Korea. 2008.3 - 2012.2

Technical Skills

Experiment and Analysis
  • Human Experiment: Psychophysics & Perception, Human Performance, Quantitative, and Qualitative
  • Statistical Analysis: Comparison (Parametric & Non-parametric), Regression, Dimension Reduction, and Survey Analysis
Data Analysis
  • Signal and Systems, Signal Processing, and Machine Learning
Hardware
  • Actuators: Shaker, Surface Transducer, Voice Coil, and ERM/LRA
  • Sensors: Load Cell, Accelerometer, Force/Torque Sensor, Microphone, and Contact Microphone
  • Data Acquisition: NI DAQ, Soundcard Real-time Processing, and Arduino
  • Virtual Reality: Oculus Rift, HTC Vive, Meta One, and Microsoft Hololens
  • Others: Iphone, Android, Optitrack Trio, Microsoft Kinect, Philips Hue & Bridge, Laser Cutter, and 3D Printer
Software (Expertise Level:0-10)
  • Programming: Matlab (9), Python(5), Processing (7), Java (2), and C# (5)
  • Tools: R (7), Adobe Photoshop (3) & Illustrator (5), LaTex (6), and Microsoft Office (10)

Media

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